ALD/ALE 2025 Session AM1-WeA: ALD Equipment I

Spatial Atomic Layer Deposition (SALD) is an emerging variant of ALD that enables rapid processing, even at atmospheric pressure, while retaining the key advantages of ALD: precise nanometer-scale thickness control, high-quality films at low temperatures, and exceptional conformality. These features make SALD particularly well-suited for high-throughput, cost-effective applications, such as next-generation photovoltaics, LEDs, and packaging.

A key strength of SALD, especially when utilizing close-proximity deposition heads, lies in its versatility. The design of these deposition heads can be easily customized, and since the process takes place in open air, no deposition chamber is required, further simplifying scalability.

To fully leverage the benefits of SALD, however, new processes must be developed to deposit functional materials with optimized properties using mild conditions and stable precursors. In this talk, I will introduce our close-proximity SALD approach and highlight our recent work in developing innovative SALD processes. Specifically, I will present a novel SALD method for depositing Cu₂O thin films with record-high transport properties, achieved despite low-temperature processing. I will also explore the critical role of precursors and process conditions in determining the final film properties. Lastly, I will demonstrate that, even in an open-air environment, it is possible to selectively deposit Cu, Cu₂O, or CuO from the same precursor simply by adjusting the coreactant.

References

Open-Air Printing of Cu₂O Thin Films with High Hole Mobility for Semitransparent Solar Harvesters

A. Sekkat, et al. Commun Mater 2, 78 (2021)

Chemical deposition of Cu₂O films with ultra-low resistivity: Correlation with the defect landscape.

A. Sekkat, et al. Nature Communications, 2022, 13, Article number: 5322

Open-Air, Low-Temperature Deposition of Phase Pure Cu₂O Thin Films as Efficient Hole-Transporting Layers for Silicon Heterojunction Solar Cells

V. S. Nguyenǂ, A. Sekkatǂ, et al. J. Mater. Chem. A, 2021, 9, 15968-15974.

Selective spatial atomic layer deposition of Cu, Cu₂O and CuO thin films in the open air: reality or fiction?

A. Sekkat, et al. Materials Today Chemistry, 2023,29, 101431.

Nanocomposites based on Cu₂O coated silver nanowire networks for high-performance oxygen evolution reaction

S. Battiato, et al. Nanoscale Advances, 2024, 6 ,4426-4433.

Assessing the Potential of Non-pyrophoric Zn(DMP)₂for the Fast Deposition of ZnO Functional Coatings by Spatial Atomic Layer Deposition

L. Johnston, et al.RSC Applied Interfaces, 2024, 1, 1371-1381

Perovskite solar cells (PSCs) are a promising candidate for large-scale commercialization, with efficiency and scalability as key factors. However, fabrication of large-area functional thin films including electron transport layers (ETLs), hole transport layers (HTLs) as well transparent conductive electrode, becomes one of the biggest obstacles for the commercial PSCs applications. This study explores low temperature SALD deposited SnO₂ ETL and aluminum-doped zinc oxide (AZO) as transparent conductive oxide electrodes to improve the performance of PSCs modules. By controlling oxygen vacancies through precursor reactivity, we achieved a high mobility of 19.4 cm²/V·s in SnO₂ ETL (deposited at 100 ℃) and ultra low sheet resistance to 3.6 Ω/sq for AZO electrode, surpassing commercial FTO (8 Ω/sq). Additionally, textured AZO electrodes, exhibited excellent optical properties with a haze of over 55% and an average transmittance of approximately 90%. Due to the advantages of SALD, the thin films demonstrated good uniformity with only 2.8% nonuniformity in film thickness and 4.6% in sheet resistance over a 400 cm² area. For the 400 cm² PSMs with AZO electrodes achieve a PCE of 20.5% and retain 87% of their initial efficiency after 600 hours of continuous illumination. This exceptional performance stems from the excellent uniformity and mobility of the SALD-deposited SnO₂ ETL and AZO elelctrode, highlighting the potential of SALD in future PSM fabrication.

References

1. Scalable Deposition of SnO₂ ETL via SALD for Large-Area Inverted Perovskite Solar Cells. Xuewei Jiang, Bin Shan, Geng Ma, Yan Xu, Xing Yang, Wenbin Zhou, Chenhui Li, Fan Yang, and Rong Chen, Chem. Eng. J. Accepted.

Atomic layer deposition (ALD) on granular materials is gaining increasing attention due to its potential applications in pharmaceuticals, nano-catalysts, and colloidal stabilization. Powders with smaller particle sizes have higher specific surface areas, which can be utilized, however, they pose significant challenges for processing, especially when particle sizes are <30µm. At these scales, van der Waals forces dominate making particles cohesive. In conventional fluidized beds, ALD is challenged by precursor gas escaping via cracks in the powder bed, having little interaction with the particles. Furthermore, particle clusters appear frequently, resulting in parts of individual particles being inaccessible to be coated, leading to non-uniform deposition. These complications necessitate dedicated systems that can overcome the inherent cohesiveness of such powders.

In our work, we set out to coat cohesive particles in an ALD fluidized bed reactor. We employed X-ray imaging to evaluate methods for improving fluidization of cohesive powders, including mechanical vibration, pulsed flow, and mechanical agitation. These methods are designed to break up structures within the powder, improving gas-solid interaction.

Our findings demonstrate that assistance methods initiate smooth fluidization, significantly enhancing gas-solid contact. We visualize the dynamics within powder beds subjected to various assistance methods and propose scalable methods to fluidize cohesive powders in order to perform ALD. We also show successful deposition of SiO₂ layers on otherwise un-fluidizable particles. These results open pathways for functionalizing fine powders for advanced technological applications.

TiO thin films are increasingly used in the semiconductor industry due to their excellent physical and chemical properties. Due to their high etching selectivity for the Si base materials and pattern fidelity, they have been mainly used for patterning applications such as hard-mask and spacers. Recently, however, due to the material’s unique optical property (High Refractive Index (R.I.) value >2.3 at 633nm), the application area has been expanded to others such as ARL (Anti-Reflection Layer) and CIS (CMOS Image Sensor) Meta-lens. As such applications often requires a thicker material than patterning films, a higher deposition rate is accordingly desirable for commercially viable productivity.

In this paper, a new process sequence was developed to increase the deposition rate while keeping the most of benefits of PEALD including film quality, uniformity, and gap fill capability. The thin film properties were characterized and compared with those of the conventional ALD process. TDMAT was used as the Ti precursor. O2 plasma was used as the reactant to grow TiO. 27.12MHz-rf source was used to generate a CCP in a commercial PEALD chamber by ASM (QCM TiO XS).

In the case of conventional ALD, there is a limitation in terms of the deposition rate even with the increasing supply of precursor due to the nature of self-limiting reaction phenomenon in PEALD. To overcome this self-limiting reaction, a low-power pulsed-plasma CVD step was introduced in a typical PEALD process cycle. (Figure1.) The new process sequence promotes the film growth by balancing the conformal deposition and the surface treatment. By this means, the new deposition rate increased to 0.94Å/sec by nearly three times compared to conventional ALD (0.34Å/sec). The results of the film deposited on a 12-inch bare Si wafer by the new process shows both uniformity and R.I. are at similar levels as the ones with conventional slow PEALD. In addition, we confirmed the step coverage is more than 80% in the pattern of open CD 90nm with aspect ratio of 3. XPS analysis also shows that the impurity concentrations of 'C' and 'N' were as low as below 2%, which is comparable to conventional PEALD process.

The high deposition rate TiO PEALD process is expected to be applicable to any new emerging applications which requires TiO’s PEALD quality yet with higher deposition rate. The ASM’s hardware technology enables this new process sequence for a novel PEALD.