AVS 72 WeM Sessions , Wednesday, November 11, 2026 8:00 AM
Wednesday Morning
Abstract Timeline | Time Periods | Topics | Schedule Overview
Click a Session Code to view its Abstracts
| Session Code | Topic | Session Name | Room |
|---|---|---|---|
| 2D-WeM | 2D | 2D Materials: Electronic, Magnetic, Mechanical, and Optical Properties | 304 |
| AIML-WeM | AIML | AI/ML for Process Monitoring, Optimization, and Autonomous Synthesis: MBE, ALD/MLD, PLD, and IR Imaging | 303 |
| AP+EL+PS+TF-WeM | AP | Thermal and Plasma Enhanced Atomic Layer Etching | 316 |
| AS-WeM | AS | Advances in Sputtering | 319 |
| EM-WeM | EM | Advances in Wide Bandgap, Piezoelectric Materials and Devices | 318 |
| FUS-WeM | FUS | Fusion Materials, Plasma-Facing Components, and Tritium Engineering | 321 |
| PS1-WeM | PS | Plasmas for 3D Integration | 315 |
| PS2-WeM | PS | Plasma Applications in Packaging and Wafer Bonding | 315 |
| SE-WeM | SE | Advanced Surface Engineering I | 303 |
| SS-WeM | SS | Heterogeneous Catalysis | 305 |
| TF1-WeM | TF | VSHOP Hybrid CVD and MLD | 317 |
| TF2-WeM | TF | VSHOP Applications II, Semiconductor Manufacturing | 317 |
| TS-WeM | TS | The Future of Temperature Sensing II | 320 |